In other words, the software problems are not merely an inconvenience — they are directly linked to the hardware performing in dangerous ways that can destroy expensive boards and components.
Instead of high-temperature spikes, use a step-based approach: Slow rise to 150∘C150 raised to the composed with power C to avoid moisture popping (popcorning). Soak Stage: Hold between 150∘C150 raised to the composed with power C 180∘C180 raised to the composed with power C to allow the heat to distribute evenly through the board. Reflow Stage: Quick peak to (depending on lead/lead-free solder) to melt the solder. achi ir6500 software hot
Utilize the board holders to keep the PCB flat, preventing bowing during the high-heat, "hot" stage of the process. Conclusion In other words, the software problems are not
The ACHI IR6500 is a highly capable machine when managed correctly. By mastering the ACHI IR6500 software, properly calibrating your thermocouples, and creating tailored "hot" profiles, you can achieve professional BGA rework results. Reflow Stage: Quick peak to (depending on lead/lead-free
Search for updated version 1.4, as recommended in this YouTube video , which offers direct links in the description.
Open the (installed from the suite). Set the following:
After installation, check . You should see “USB Serial Port (COMx)”.